Fresh

Mechanical Design Engineer - Semiconductor Packaging

Intel · US, Arizona, Phoenix

Within normal posting window. For now.

Posted (ATS)

7/31/2026, 12:00:00 AM

Updated (ATS)

7/31/2026, 12:00:00 AM

First seen by us

8/13/2026, 12:17:46 AM

Last re-seen

8/22/2026, 12:46:04 AM

Distinct job IDs

Open in parallel

Work locations

Cumulative days active

Stagnancy score

ATS job ID

JR0286059

Rotation timeline

Every ATS job ID we've matched to this same normalized title, oldest first. "Posted" is the date the ATS reports; "last confirmed open" is the last time we saw it live.

Rotation 1LatestID JR0286059Still openView listing →
Location
US, Arizona, Phoenix
Posted (ATS)
Jul 31, 2026
Last confirmed open
Aug 22, 2026
Open for
22 days +

Data provenance

Source platform: workday
Source API URL: https://intel.wd1.myworkdayjobs.com/wday/cxs/intel/external/jobs
Latest listing found: https://intel.wd1.myworkdayjobs.com/External/job/US-Arizona-Phoenix/Mechanical-Design-Engineer---Semiconductor-Packaging_JR0286059
Stream ID: 094725c3-a50f-4e72-a191-4685d9696976

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