Fresh

Advanced Packaging Module Development Engineer

Intel · US, Oregon, Hillsboro

Within normal posting window. For now.

Posted (ATS)

9/25/2026, 12:00:00 AM

Updated (ATS)

9/25/2026, 12:00:00 AM

First seen by us

9/25/2026, 10:15:31 PM

Last re-seen

10/18/2026, 7:31:09 AM

Distinct job IDs

Open in parallel

Work locations

Cumulative days active

Stagnancy score

ATS job ID

JR0287417

Rotation timeline

Every ATS job ID we've matched to this same normalized title, oldest first. "Posted" is the date the ATS reports; "last confirmed open" is the last time we saw it live.

Rotation 1LatestID JR0287417Still openView listing →
Location
US, Oregon, Hillsboro
Posted (ATS)
Sep 25, 2026
Last confirmed open
Oct 18, 2026
Open for
23 days +

Data provenance

Source platform: workday
Source API URL: https://intel.wd1.myworkdayjobs.com/wday/cxs/intel/external/jobs
Latest listing found: https://intel.wd1.myworkdayjobs.com/external/job/US-Oregon-Hillsboro/Advanced-Packaging-Module-Development-Engineer_JR0287417
Stream ID: 5232dac8-a7a7-474f-b259-74b31475a12c

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